regarding the change of names mentioned in the document, such as hitachi electric and hitachi xx, to renesas technology corp. the semiconductor operations of mitsubishi electric and hitachi were transferred to renesas technology corporation on april 1st 2003. these operations include microcomputer, logic, analog and discrete devices, and memory chips other than drams (flash memory, srams etc.) accordingly, although hitachi, hitachi, ltd., hitachi semiconductors, and other hitachi brand names are mentioned in the document, these names have in fact all been changed to renesas technology corp. thank you for your understanding. except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself. renesas technology home page: http://www.renesas.com renesas technology corp. customer support dept. april 1, 2003 to all our customers
cautions keep safety first in your circuit designs! 1. renesas technology corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. trouble with semiconductors may lead to personal injury, fire or property damage. remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. notes regarding these materials 1. these materials are intended as a reference to assist our customers in the selection of the renesas technology corporation product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to renesas technology corporation or a third party. 2. renesas technology corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. all information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by renesas technology corporation without notice due to product improvements or other reasons. it is therefore recommended that customers contact renesas technology corporation or an authorized renesas technology corporation product distributor for the latest product information before purchasing a product listed herein. the information described here may contain technical inaccuracies or typographical errors. renesas technology corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. please also pay attention to information published by renesas technology corporation by various means, including the renesas technology corporation semiconductor home page (http://www.renesas.com). 4. when using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. renesas technology corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. renesas technology corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. please contact renesas technology corporation or an authorized renesas technology corporation product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. the prior written approval of renesas technology corporation is necessary to reprint or reproduce in whole or in part these materials. 7. if these products or technologies are subject to the japanese export control restrictions, they must be exported under a license from the japanese government and cannot be imported into a country other than the approved destination. any diversion or reexport contrary to the export control laws and regulations of japan and/or the country of destination is prohibited. 8. please contact renesas technology corporation for further details on these materials or the products contained therein.
HVU300C variable capacitance diode for vhf tuner ade-208-1631 (z) rev.0 feb. 2003 features ? high capacitance ratio (n = 14.5 min) and suitable for wide band tuner. ? low series resistance and good c-v linearity. ? ultra small resin package (urp) is suitable for surface mount design. ordering information type no. laser mark package code HVU300C e2 urp pin arrangement cathode mark mark 12 e2 1. cathode 2. anode
HVU300C rev.0, feb. 2003, page 2 of 5 absolute maximum ratings (ta = 25c) item symbol value unit peak reverse voltage v rm * 1 35 v reverse voltage v r 34 v junction temperature tj 150 c storage temperature tstg ?55 to +150 c note: 1. r l = 10 k ? electrical characteristics (ta = 25c) item symbol min typ max unit test condition i r1 ??10 v r = 32 v reverse current i r2 ? ? 100 na v r = 32 v, ta = 60c c 2 39.5 ? 47.0 v r = 2 v, f = 1 mhz capacitance c 25 2.6 ? 3.0 pf v r = 25 v, f = 1 mhz capacitance ratio n 14.5 ? ? ? c 2 / c 25 series resistance r s ??1.1 ? v r = 5 v, f = 470 mhz matching error ? c/c * 1 ??2.0%v r = 2 to 25 v, f = 1 mhz note: 1. c.c system (continuous connected taping system) enable to make any 10 pcs of ? c/c continuous in a reel , expect extention to another group. calculate matching error, (cmax ? cmin) cmin ? c/c = 100 (%)
HVU300C rev.0, feb. 2003, page 3 of 5 main characteristic 0 1020304050 1.0 10 60 50 20 10 0 0.5 30 40 30 f = 1mhz 1.0 10 0 0.4 0.8 1.2 1.6 0.5 2.0 30 0.2 0.6 1.0 1.4 1.8 f = 470mhz 0.5 1.0 10 -1.5 -1.0 -0.5 0 -2.0 30 10 ? 6 10 ? 8 10 ? 9 10 ? 10 10 ? 13 10 ? 7 10 ? 12 10 ? 11 reverse voltage v r (v) fig.1 reverse current vs. reverse voltage reverse current i r (a) capacitance c (pf) reverse voltage v r (v) fig.2 capacitance vs. reverse voltage reverse voltage v r (v) fig.3 series resistance vs. reverse voltage series resistance r s ( ? ) reverse voltage v r (v) fig.4 linearity factor vs. reverse voltage l f = d (logc)/ d (logv r )
HVU300C rev.0, feb. 2003, page 4 of 5 package dimensions hitachi code jedec jeita mass (reference value) urp conforms ? 0.004 g 1.7 0.15 2.5 0.15 0.3 0.15 1.25 0.15 0 ? 0.10 0.9 0.15 as of july, 2002 unit: mm
HVU300C rev.0, feb. 2003, page 5 of 5 keep safety first in your circuit designs! 1. renesas technology corporation puts the maximum effort into making semiconductor products better and more reliable, but ther e is always the possibility that trouble may occur with them. trouble with semiconductors may lead to personal injury, fire or property damage. remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. notes regarding these materials 1. these materials are intended as a reference to assist our customers in the selection of the renesas technology corporation p roduct best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to renesas technology corporat ion or a third party. 2. renesas technology corporation assumes no responsibility for any damage, or infringement of any third-party's rights, origin ating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. all information contained in these materials, including product data, diagrams, charts, programs and algorithms represents i nformation on products at the time of publication of these materials, and are subject to change by renesas technology corporation without notice due to product improvements or other reas ons. it is therefore recommended that customers contact renesas technology corporation or an authorized renesas technology corporation product distributor for the latest produ ct information before purchasing a product listed herein. the information described here may contain technical inaccuracies or typographical errors. renesas technology corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracie s or errors. please also pay attention to information published by renesas technology corporation by various means, including the renesas te chnology corporation semiconductor home page (http://www.renesas.com). 4. when using any or all of the information contained in these materials, including product data, diagrams, charts, programs, a nd algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. renesas technology corp oration assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. renesas technology corporation semiconductors are not designed or manufactured for use in a device or system that is used un der circumstances in which human life is potentially at stake. please contact renesas technology corporation or an authorized renesas technology corporation product distributor wh en considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or u ndersea repeater use. 6. the prior written approval of renesas technology corporation is necessary to reprint or reproduce in whole or in part these materials. 7. if these products or technologies are subject to the japanese export control restrictions, they must be exported under a lic ense from the japanese government and cannot be imported into a country other than the approved destination. any diversion or reexport contrary to the export control laws and regulations of japan and/or the country of destination is pro hibited. 8. please contact renesas technology corporation for further details on these materials or the products contained therein. sales strategic planning div. nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan http://www.renesas.com copyright ? 2003. renesas technology corporation, all rights reserved. printed in japan. colophon 0.0
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